Copper-Clad Laminate
The dry process technology applied to high-frequency and high-speed copper-clad laminates, with its solvent-free process, simplifies the production flow, reduces energy consumption and pollution, while improving production efficiency and lowering costs. PTFE substrates feature low dielectric constant, small dielectric loss, and resistance to high and low temperatures, providing a stable foundation for high-frequency and high-speed signal transmission. The high-frequency and high-speed copper-clad laminates based on this have extremely low loss in signal transmission and can stably support the transmission of ultra-high-frequency signals such as 5G and millimeter waves. They are widely used in fields such as 5G communication base stations, satellite communications, AI high-performance servers, and automotive radars, effectively promoting the development of electronic devices towards higher speed and higher frequency.
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