Introduction to the Application of High-Speed and High-Frequency Copper-Clad Laminate Products
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High-speed and high-frequency copper-clad laminates are high-performance printed circuit substrates that support GHz-level signal transmission, feature low dielectric constant (Dk), low dissipation factor (Df) and high dimensional stability. They are mainly applied in 5G/6G communications, high-speed data centers, automotive electronics, aerospace and national defense fields, serving as the critical fundamental materials to ensure signal integrity and system reliability.
Our products adopt halogen-free PTFE substrates. With ultra-low dielectric loss, stable dielectric constant, as well as excellent thermal management and environmental resistance performance, they can fully meet the high-frequency and high-speed signal transmission requirements of 5G/6G communications, high-speed data centers, automotive radars, aerospace and other fields. They are the preferred substrates for ensuring signal integrity and long-term reliability of high-end electronic devices.

Case 1: 5G Macro Base Station Radio Remote Unit (RRU) – Enabling Long-distance and High-efficiency Coverage of High-frequency Signals
Project Background
A leading communication equipment manufacturer launched an upgrade project for the radio frequency power amplifier (PA) module operating in the Sub-6GHz frequency band, aiming to improve the coverage radius and signal stability of 5G macro base stations. The project needed to address critical issues with traditional substrates, such as severe signal attenuation and performance drift under high-temperature conditions. It also required low-loss signal transmission at the 10GHz frequency band, while meeting the operational requirements of a wide temperature range from -55℃ to 125℃.

Product Application & Core Performance Compatibility
The high-speed and high-frequency copper-clad laminate selected for this project is precisely engineered to match the technical requirements of the base station:
It adopts a halogen-free PTFE substrate that complies with the ROHS and REACH environmental standards, meeting the green production requirements of base station manufacturing.
With an ultra-low dielectric loss (Df) of 0.0007 and a stable dielectric constant (Dk) of 3±0.04, it effectively minimizes energy loss and phase distortion during signal transmission.
Compared with traditional FR-4 materials, it reduces signal attenuation by 30%, significantly enhancing the transmission efficiency of radio frequency signals.
In addition, the product’s low coefficient of thermal expansion and a TCDK value of +6.4 enable efficient thermal management. Combined with its exceptional resistance to extreme temperature and humidity, which is supported by a TD value of 534, it can withstand the high-temperature loads exceeding 120℃ in local areas of the base station PA module. This prevents substrate deformation and circuit failure caused by thermal expansion and contraction.

Application Results
Field tests show that the 12-layer hybrid-pressed radio frequency board based on this copper-clad laminate achieves the following outstanding performance when carrying 128-channel radio frequency links: the insertion loss is controlled within 0.15dB/inch, and the phase consistency error is less than 2°. After a 1,000-hour high-temperature and high-humidity cycle test, the product demonstrated zero performance degradation.
As a result, the coverage radius of the base station has been increased by 23% compared with the original solution, and the failure rate has been reduced to 0.02ppm. It fully meets the stringent operational requirements of 5G macro base stations for intensive high-frequency signal transmission and high-power operation.
Case 2: 77GHz Automotive Millimeter-wave Radar – Ensuring Precise Environmental Perception for Autonomous Driving
Project Background
For an L3-level autonomous driving project of a premium automobile manufacturer, a 77GHz millimeter-wave radar module needs to be developed to support ADAS functions such as vehicle collision avoidance and lane keeping. The core requirements are to improve target recognition accuracy and adaptability to harsh environments, while resolving key issues including signal crosstalk at high frequencies, performance drift caused by temperature fluctuations, and reliability challenges under operating conditions such as rain and high temperatures.
Product Application & Core Performance Compatibility Tailored to the requirements of automotive scenarios, the high-speed and high-frequency copper-clad laminate selected for this radar module features a stable Dk value of 3±0.04, which maintains phase consistency at the 77GHz high-frequency band. Combined with an ultra-low Df of 0.0007, it significantly reduces energy loss during signal transmission, thus remarkably enhancing the radar’s detection range and resolution. Its low coefficient of thermal expansion is highly matched with copper foil, effectively preventing interlayer delamination under wide-temperature cycles ranging from -40℃ to 125℃, and ensuring structural stability amid vehicle vibration during driving. In addition, its halogen-free and eco-friendly material, together with green production processes, meets the environmental requirements of automotive electronics. The excellent resistance to extreme temperatures and high humidity, enabled by a TD value of 534, allows the module to operate in harsh weather conditions such as heavy rain and dense fog, ensuring stable radar signal output.
Application Results Field test data shows that the signal crosstalk of this millimeter-wave radar module has been improved from -30dB in traditional solutions to -45dB, with target recognition accuracy increased by 40%. The angular resolution of 0.1° enables precise capture of short-distance obstacles. Under dense fog and heavy rain conditions, the false alarm rate has been reduced by 42%. The module has passed the AEC-Q100 automotive reliability certification, providing stable and accurate environmental perception support for autonomous driving systems.
Case 3: AI Server Orthogonal Backplane – Supporting 224Gbps High-Speed Signal Interconnection
Project Background A computing power enterprise launched an upgrade project for AI servers based on the NVIDIA GB300 architecture, which required the development of a 40-layer orthogonal backplane to support high-speed signal transmission of 224Gbps and above, meeting the Exascale computing power demand. The core pain points to address included signal attenuation and crosstalk under high-frequency and high-speed conditions, as well as heat accumulation caused by high power consumption. Meanwhile, the solution also needed to comply with environmental regulations and meet the requirements of large-scale production.
Product Application & Core Performance Compatibility The 38 layers of this backplane adopted the hybrid-pressing process of high-speed and high-frequency copper-clad laminates. With an ultra-low Df of 0.0007 and stable Dk, the product reduced signal attenuation to less than 1/10 of that of traditional materials, effectively ensuring the integrity of 224Gbps signals and suppressing crosstalk and impedance mismatch. The TCDK value of +6.4 and low coefficient of thermal expansion enabled efficient thermal management, rapidly dissipating the heat generated during server operation and avoiding performance degradation under high power consumption. Compliant with ROHS and REACH standards, the product adopted green production processes that reduced the carbon footprint of server manufacturing. Moreover, it was compatible with multi-layer hybrid pressing and high-precision drilling processes, achieving a mass production yield of 99.2% and meeting the large-scale delivery requirements of AI servers.
Application Results The upgraded AI server backplane controlled signal transmission latency at the microsecond level and reduced the bit error rate to below 10⁻⁹, supporting seamless adaptation to 400G/800G optical module interfaces. Compared with traditional copper cable interconnection solutions, it improved energy efficiency by 18% and significantly increased the PCB value per unit. Meanwhile, it achieved dual breakthroughs in computing power and environmental performance, providing stable support for high-density computing scenarios such as AI large model training and big data analysis.
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