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Tsingyane Attends the 26th China Copper-Clad Laminate Technology Seminar and Delivers Keynote Speech

Tsingyane Attends the 26th China Copper-Clad Laminate Technology Seminar and Delivers Keynote Speech

2025-10-17 17:09

On October 16, the 26th China Copper-Clad Laminate Technology Seminar grandly kicked off in Zhuhai. With the theme of "Collaborative Innovation to Empower the Future," this seminar gathered leading enterprises and industry experts in the copper-clad laminate (CCL) industrial chain.

As a representative enterprise in the CCL field, Ms. Luo Xufang, R&D Director of Tsingyane, was invited to attend the seminar and delivered a keynote speech titled "Application and Development of Dry Film-Forming Process in High-Frequency Copper-Clad Laminates", which received high recognition and positive feedback from the participating guests.

Star Product: High-Frequency & High-Speed Copper-Clad Laminates

Based on Powder-Integrated Film-forming technology (PIFs™), Tsingyane has successfully developed high-frequency & high-speed CCLs, including two core product series: TY-HF3003 and TY-HS1100. These products feature excellent dielectric properties, consistency, and reliability, and can be widely applied in fields such as 5G communications, AI computing power, and automotive millimeter-wave radar.

Technological Breakthrough: Dual Advantages in Performance and Cost

In terms of core technologies, Tsingyane has achieved uniform dispersion of resin and fillers at the microscale through ceramic powder surface modification and patented nano-mixing technology. Meanwhile, the company adopts a solvent-free dry film-forming process, which fundamentally eliminates solvent residues and improves the consistency of dielectric properties within boards, between boards, and across batches. This process not only simplifies the production workflow but also reduces overall costs.

Industrial Progress: Facilitating Localization Substitution

Currently, Tsingyane’s high-frequency & high-speed CCL products have passed the certification of leading PCB manufacturers. The company also plans to build a mass production line with an annual output of 1–2 million square meters in Changzhou. By leveraging customized materials, patented mixing processes, and solvent-free film-forming technology to achieve performance breakthroughs, Tsingyane is committed to breaking foreign monopolies and promoting the industrialization and import substitution of domestic high-end CCLs.

Future Layout: Deepening Technology and Expanding Production Capacity

In the future, Tsingyane will continue to deepen its focus on the fields of powder film-forming and high-frequency materials. On one hand, it will continuously advance technological iteration to consolidate its core technological advantages; on the other hand, it will accelerate production capacity construction to ensure product supply capacity. Through this dual-drive strategy, Tsingyane will help China’s high-end CCL industrial chain achieve independent control and high-quality development!


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