High-Frequency High-Speed Copper Clad Laminate (CCL): Low Dielectric Constant, Low Loss, Special Substrate for 5G/AI Servers

As 5G communication technology iterates and upgrades, and AI servers rapidly develop towards high speed and high density, the integrity, stability, and efficiency of signal transmission have become core requirements for high-end electronic devices. As the core substrate of PCBs, the dielectric performance and loss characteristics of copper clad laminates (CCLs) directly determine the transmission quality of high-speed signals. Qingyan Electronics has deep roots in the field of high-frequency and high-speed CCLs. With profound technical accumulation and independent R&D capabilities, we have launched the TY series high-frequency and high-speed CCLs, tailor-made for 5G communication, AI servers, and high-speed data centers. With the core advantages of ultra-low dielectric constant and extremely low loss, we break technical barriers and provide solid support for the stable operation of high-end electronic devices.

The core highlight of Qingyan Electronics' TY series high-frequency and high-speed CCLs lies in the adoption of independently developed PIFs powder film-forming technology. We implement full-process refined control from raw materials to production processes, ultimately achieving high stability of dielectric constant (DK) and extremely low loss factor (DF). It perfectly meets the strict requirements of 5G base stations, AI server 224G/112G high-speed signal transmission, and millimeter-wave applications, becoming the preferred substrate for high-end high-speed PCBs and demonstrating the technical strength of domestic CCLs.

Among them, the TY-HS-1100, as a flagship high-speed substrate, has achieved industry-leading breakthroughs in performance. Its dielectric constant DK is stably controlled at 3±0.04, with minimal fluctuation in the wide frequency range, ensuring no obvious attenuation or distortion during high-speed signal transmission. The loss factor DF is as low as 0.0004, a 98% reduction compared with traditional FR-4 CCLs (DF≈0.02), which greatly reduces energy loss during signal transmission and improves signal integrity. It provides reliable guarantee for high-end application scenarios such as AI server core computing boards, high-speed backplanes, and 224G/112G high-speed interconnection. At the same time, this product has core characteristics of extremely low water absorption, excellent Z-axis coefficient of thermal expansion (CTE), strong dimensional stability, and high copper foil peel strength, which can adapt to harsh production processes such as multi-layer PCB lamination and lead-free soldering, meeting the long-term stable operation needs of high-end electronic devices.

To meet the market demand for balancing high performance and cost, Qingyan Electronics has simultaneously launched the TY-HS-3003 high-performance general-purpose substrate. Its dielectric constant DK is stable at 3.0±0.04, with excellent consistency in wide-frequency performance, and the loss factor DF is as low as 0.0007. While maintaining the advantage of ultra-low loss, it has higher cost performance and processability, and is compatible with lead-free processes. It is widely used in scenarios such as 5G base stations, high-speed switches, optical modules, and automotive millimeter-wave radars, achieving the optimal balance between performance and cost and helping enterprises reduce R&D and production costs of high-end products.

Compared with traditional CCLs, Qingyan Electronics' TY series high-frequency and high-speed CCLs stand out in the high-end market with four core advantages. First, the ultra-low loss characteristic maximizes signal integrity, and the excellent DF performance effectively reduces high-frequency signal transmission attenuation and delay, perfectly matching the high-speed signal transmission needs of AI servers and high-speed data centers. Second, the low dielectric performance is stable, with DK value accurately controllable and minimal fluctuation in wide frequency, which greatly reduces PCB design difficulty and improves product yield. Third, it has outstanding high reliability and heat resistance, with high glass transition temperature (Tg) and low thermal expansion coefficient, maintaining stability in a wide temperature range, compatible with harsh processes such as lead-free soldering and multi-layer lamination, ensuring long-term product reliability. Fourth, it is independently developed domestically. With the technical support of Shenzhen Tsinghua University Research Institute, the independent PIFs powder film-forming technology breaks the monopoly of overseas brands. Its performance is comparable to that of international top plates such as Rogers and Panasonic, and it has higher cost performance, helping domestic electronic enterprises achieve independent control of high-end substrates.

At present, Qingyan Electronics' TY series high-frequency and high-speed CCLs have been widely applied in three core scenarios: in the field of AI servers and data centers, they are adapted to high-speed backplanes, core computing boards, and 224G/112G high-speed interconnection PCBs, ensuring high-speed and stable data transmission; in the field of 5G communication, they support the efficient operation of millimeter-wave base stations, radio frequency units, optical modules, and high-speed switches, helping the large-scale implementation of 5G technology; in the field of high-end electronics, they are applied to automotive radars, industrial control, high-frequency test equipment, etc., providing core substrate support for various high-end electronic devices.

In the future, Qingyan Electronics will continue to deepen its focus on the field of high-frequency and high-speed CCLs. Relying on independent R&D advantages, we will continuously optimize product performance, launch special substrates more in line with market needs, break overseas technical monopolies, help the high-quality development of domestic 5G, AI, high-speed data center and other industries, and empower the high-end electronic industry with domestic core technologies.