M9 High-Speed High-Frequency CCL: Specialized Substrate for AIDC AI Server Motherboards

With the rapid iteration of computing power in AIDC intelligent computing centers, AI servers and high-performance computing motherboards have raised extremely strict requirements for PCB substrates in terms of signal transmission accuracy, parameter stability, and process consistency. Traditional FR-4 and conventional high-frequency copper clad laminates (CCL) generally adopt wet coating processes, which are prone to inherent defects such as solvent residue, uneven microstructure, parameter drift, and severe high-frequency signal attenuation, making them unable to support the high-bandwidth, high-concurrency, and ultra-low-latency transmission demands of AI computing power. Custom-developed for AIDC AI server motherboards, Qingyan Electronics M9 high-speed CCL adopts PTFE as the base material and relies on self-developed powder film-forming technology to eliminate the drawbacks of traditional wet processes. Featuring a dense and uniform plate structure, ultra-low electrical loss, and excellent batch consistency, it serves as a core specialized substrate for high-end computing power devices. All high-speed and high-frequency CCL series adopt solvent-free powder film-forming technology with customized formula adjustments to adapt to high-speed computing transmission and ultra-high-frequency communication scenarios respectively.

1. Core Performance: Ultra-Low Loss Enabled by Advanced Powder Film-Forming Technology

Built on PTFE base material and empowered by proprietary powder film-forming technology, the M9 high-speed CCL effectively avoids solvent residue, structural inhomogeneity and parameter drift commonly found in traditional wet-process substrates, maximizing the inherent electrical advantages of the base material. It delivers industry-leading ultra-low loss performance with stable electrical parameters: DK=3, DF=0.0004, perfectly matching the high-speed and high-bandwidth signal transmission requirements of AI servers.

Compared with conventional wet-process plates, the M9 series features a denser and more uniform internal microstructure, significantly reducing high-speed signal transmission loss and phase delay. It ensures accurate and synchronous transmission of massive data and multi-channel concurrent signals in computing centers, effectively preventing computing power attenuation and data distortion at the substrate level.

Benefiting from advanced powder film-forming technology, the substrate achieves superior parameter stability and anti-interference capability. It maintains consistent electrical performance without obvious parameter drift under wide-frequency operation, alternating high and low temperatures, and 7×24-hour high-load continuous operation, fully adapting to the rigorous operating conditions of AIDC intelligent computing centers.

2. Core Advantages of M9 High-Speed CCL for AI Server Motherboards

1. Ultra-Low Loss Structure Releases Full Computing Power

Signal attenuation, crosstalk and latency caused by microstructural unevenness and solvent residue are key bottlenecks limiting high-speed signal transmission of AI servers. Adopting powder film-forming technology, the M9 substrate achieves a residue-free, highly dense internal structure, minimizing energy loss and phase offset during high-speed signal transmission. It stabilizes multi-channel high-speed signal synchronization, releases the peak computing power of servers, and avoids computing power loss and data distortion caused by substrate process defects.

2. Exceptional Parameter Stability Without Drift Under Heavy Loads

Long-term high-load operation of computing centers easily causes structural stress and residual-induced parameter drift in traditional wet substrates, resulting in signal instability and transmission errors. In contrast, the M9 substrate forms a uniformly cured internal structure with low internal stress through advanced powder film-forming and thermoforming processes. It maintains highly stable electrical performance and accurate impedance matching under temperature cycling and continuous heavy-load operation, fully suitable for high-end AI servers, GPU computing accelerators, high-speed backplanes and other core computing hardware.

3. Excellent Process Adaptability for High-Precision PCB Mass Production

AI server motherboards are characterized by multi-layer stacking, high circuit density, micro-apertures and fine traces, which demand extremely high flatness and dimensional stability of substrates. The powder film-forming technology enables uniform thickness, outstanding flatness and ultra-low deformation rate for M9 plates. With low water absorption and superior thermal shock resistance, it achieves high yield and excellent batch consistency throughout lamination, drilling and etching processes, fully meeting the precision processing and mass production requirements of high-end computing motherboards.

4. Green Solvent-Free Process Improves Reliability and Reduces O&M Costs

Different from traditional wet processes that rely on organic solvents and bring residual risks, the powder film-forming process eliminates solvent usage and volatile residues entirely. It greatly enhances the substrate’s aging resistance, high-temperature resistance, humidity resistance and delamination resistance. The M9 substrate maintains stable physical and electrical performance under long-term high-load operation without deformation, delamination or performance degradation. It improves the service life and operational reliability of server motherboards, reduces equipment failure rates and iterative O&M costs of computing centers, and complies with green manufacturing standards.

3. Product Positioning & Application Scenarios

M9 High-Speed CCL: Based on powder film-forming technology, it targets high-speed computing scenarios and is widely applied to AIDC AI server motherboards, GPU computing accelerator cards, high-speed switch backplanes and other high-speed signal transmission devices, ensuring low-loss and high-stability computing transmission.

High-Frequency CCL: Adopting the identical powder film-forming platform with optimized formula tuning, it focuses on ultra-high-frequency communication scenarios such as millimeter-wave communication and radio frequency base stations, forming a complete product matrix covering both computing and high-frequency communication fields.

4. Conclusion

The performance upgrade of AIDC computing power relies on iterative optimization of substrate manufacturing technology rather than simple material replacement. Based on PTFE material and empowered by self-developed powder film-forming technology, Qingyan Electronics M9 high-speed CCL fundamentally solves the inherent defects of traditional wet substrates including high loss, poor uniformity and unstable parameters. With ultra-low electrical loss, high parameter consistency and excellent precision process adaptability, it precisely meets the high-speed, high-stability and low-latency transmission demands of AI computing hardware. All Qingyan high-speed and high-frequency substrates adopt independent and controllable powder film-forming technology, covering dual tracks of computing and communication through differentiated tuning, providing high-performance, high-reliability and green core substrate solutions for high-end electronic hardware upgrading.